Ultra-steady Surface Mount PAR® Transient Voltage Suppressors (TVS) DO-218AB SM8S
Qhov zoo ntawm DO-218AB SM8S:
1. Vim yog kev siv tshuab ntawm Tshuaj Etching Method, cov txiaj ntsig tsis zoo ntawm txoj kev txiav ncaj qha raug tshem tawm.
2. Muaj hwj chim nyob rau hauv qhov rov qab surge vim lub nti loj dua counterparts.
3. Tsis tshua muaj qhov tsis ua haujlwm nyob rau hauv cov huab cua sib txawv thiab thaj chaw
4. Pom zoo los ntawm AEC-Q101 tus qauv
5. Diode lub zog yog optimized, tau txais txiaj ntsig los ntawm kev tiv thaiv kev tshawb fawb ntawm PN junction.
TSEEM CEEB:
VBR: 11.1V txog 52.8V
VWM: 10 V to 43 V
PPPM (10 x 1000 μs): 6600 W
PPPM (10 x 10 000 μs): 5200 W
pw: 8 w
IB: 700 A
TJ max.: 175 ° C
Polarity: Uni-directional
Pob: DO-218AB
Cov txheej txheem ntawm Chip's Production
1. Tsis siv neeg luam ntawv(Ultra-precise tsis siv neeg wafer luam ntawv)
2. Tsis siv neeg Thawj-etching(Tsis Siv Neeg Etching Khoom, CPK> 1.67)
3. Tsis Siv Neeg Polarity Test (Precise Polarity Test)
4. Tsis siv neeg los ua ke (Tus kheej-tsim Tsis Siv Neeg Precise Assembly)
5. Soldering (Kev tiv thaiv nrog kev sib xyaw ntawm Nitrogen & Hydrogen
Nqus Soldering)
6. Tsis Siv Neeg Thib Ob-etching (Tsis Siv Neeg Thib Ob-etching nrog Ultra-ntshiab Dej)
7. Tsis Siv Neeg Gluing (Uniform Gluing & Precise Calculation is Realized by Automatic Precise Gluing Equipment)
8. Tsis Siv Neeg Thermal Test (tsis siv neeg xaiv los ntawm Thermal Tester)
9. Tsis Siv Neeg Test (Multifunctional Tester)
